Compatible from φ1μm! High precision and high open area electroformed sieve 'Stealth Sieve'
Achieve astonishing precision! Capable of handling large products up to φ32 inches! The R-shaped cross-section prevents damage to spherical particles! Easy removal of clogs!
The "Stealth Sieve" is a high-precision electroformed sieve realized by combining X-ray lithography technology and hard electroforming technology. Due to its R-shaped cross-section, it does not scratch spherical particles and makes clogging removal easy. Additionally, by applying a highly corrosion-resistant material developed with hard electroforming technology, it can handle corrosive powder particles as well. 【Features】 ■ High precision and high open area ratio ■ High aspect ratio and taper formation ■ No scratching and no clogging ■ Suitable for corrosive powder particles ■ Various opening shapes available *For more details, please refer to the PDF document or feel free to contact us.
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The ultra-fine processing technology (photoelectroforming) provided by Optonics Precision is utilized in various fields such as precision machinery, electronics, medical devices/bio-related fields, automotive parts, sensor-related areas, display fields, and optical equipment. Moving forward, Optonics Precision aims to devote all its efforts to the development of even more groundbreaking and innovative new technologies, contributing to the advancement of society.
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