High-precision analysis of silicon wafer surfaces in Wafer ATR.

[Free Gift] Introducing a product that is a new approach utilizing the MIRS method.

The characteristics of the surface of silicon wafers (Si wafers) greatly influence their functionality as a material, and the chemical evaluation of various thin films formed on the wafer surface is becoming increasingly important. The "Wafer ATR" introduced in this document is a new approach that applies the so-called MIRS method, and it is a product of research results in collaboration with the group at the CEA-Leti, the French Atomic Energy Commission's electronics and information research institute. [Contents] ■ Introduction ■ Wafer ATR - Improved sensitivity through multiple internal reflections - Necessary information during measurement ■ Measurement examples ■ Discriminant analysis ■ Conclusion ■ References *For more details, please refer to the PDF document or feel free to contact us.

Analytical Equipment and Devices