Semiconductor device measurement instrument cover
This is a cover for a semiconductor device made from 0.5mm SPCC. It undergoes punching, pre-processing, bending, and spot welding. Once the forming is complete, trivalent zinc plating and painting are performed, and it is finished. The production time, including plating and painting, is approximately 5 days to 1 week.
![product_img007[1].jpg](https://image.mono.ipros.com/public/product/image/e5c/2000432510/IPROS474398406916873165.jpg?w=280&h=280)
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basic information
Material: SECC / t=0.5 Dimensions: 91 × 131 × 70 Process: Sheet metal processing, welding Application: Semiconductor device measurement instrument cover
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Semiconductor device measurement instrument cover
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If it's about manufacturing, leave it to Higashi Kai Manufacturing. We have the technical capability to solve difficult products that other companies have turned down. We can provide consistent support from various processing to plating, painting, and silk printing. With our quick response and sincere approach, we will turn your ideas into reality. Precision sheet metal / Can manufacturing sheet metal / Press processing / Machining / Resin cutting processing / Plastic processing / Various assembly processing / Sheet metal welding / Can welding / Development, design / Assembly, installation
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