Semiconductor device panel
This is a precision sheet metal processing product made from SUS430 (HL material) with a thickness of 1.0mm. The main process starts with punching, followed by pre-processing and bending. After shaping is completed, silk printing is performed on the surface, followed by final inspection. This product is used as a panel for semiconductor equipment. The production time, including silk printing, is approximately 3 days based on a standard of up to 100 lots.
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basic information
Material: SUS430 (HL material) / t=1.0 Dimensions: 148 × 170 Process: Precision sheet metal processing, silk printing Application: Semiconductor equipment panel
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Applications/Examples of results
This product is used as a panel for semiconductor devices.
Company information
If it's about manufacturing, leave it to Higashi Kai Manufacturing. We have the technical capability to solve difficult products that other companies have turned down. We can provide consistent support from various processing to plating, painting, and silk printing. With our quick response and sincere approach, we will turn your ideas into reality. Precision sheet metal / Can manufacturing sheet metal / Press processing / Machining / Resin cutting processing / Plastic processing / Various assembly processing / Sheet metal welding / Can welding / Development, design / Assembly, installation
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