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  6. MH-500 Automatic Single Diamond Wire Saw

MH-500 Automatic Single Diamond Wire Saw

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MH-500

last updated:Jul 02, 2025

ジャパンクリエイト
ジャパンクリエイト
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Suitable for cutting brittle materials such as silicon wafers, glass, and quartz using diamond wire for edge trimming.

- Pricing suitable for research prototypes - Automatic cutting on an XY table using a high-precision 5-phase microstepping motor with a closed-loop system. The X-axis is equipped with a rotation mechanism. - Cutting under constant stress Automatic cutting under constant stress is possible by detecting wire deflection with a high-precision position sensor and controlling the movement speed through feedback to the stepping motor. - Simple design with easy operation via a touch panel.

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ダイヤモンドワイヤーソー1.jpg

MH-500 Automatic Single Diamond Wire Saw

ダイヤモンドワイヤーソー1.jpg
ダイヤモンドワイヤーソー1.jpg
  • Special site - Product/service details - https://pr.mono.ipros.com/japancreate/product/

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MH-500 Automatic Single Diamond Wire Saw

MH-500 Automatic Single Diamond Wire Saw

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ジャパンクリエイト

ジャパンクリエイト

Testing, Analysis and Measurement

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Japan Create has been challenging cutting-edge technologies to respond to the diversification of the semiconductor industry with high precision, labor-saving, and miniaturization. We seek infinite possibilities in high technology and create reliable know-how that matches user needs with our uniqueness. We will continue to strive towards high-level technology.

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