[Analysis Case] Non-destructive 3D Structural Observation of SiC Discrete Packages
Non-destructive three-dimensional observation of the internal structure of a discrete package.
In investigations of competitor products and inspections of defective items, an internal structural examination is necessary first. X-ray CT allows for non-destructive acquisition of transmission images from within the sample, enabling three-dimensional reconstruction. This document presents a case study where a discrete package equipped with SiC chips was observed using X-ray CT as part of a product investigation. After confirming the structure with X-ray CT, we propose conducting physical analysis (failure analysis) using MST.
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Measurement Method: X-ray CT Method Product Field: Power Devices Analysis Purpose: Shape Evaluation, Product Investigation, Deterioration Investigation, Reliability Evaluation, Structural Evaluation
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MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!