We also support special processing such as ZAGRI processing, tap hole processing, and countersunk screw hole processing!
The "Metal Core Wiring Board" is a double-sided high thermal conductivity wiring board that uses metal as the core material. It supports high thermal conductive materials up to 10 W/m·K and low elastic materials (to reduce solder cracking), as well as "special insulation layers," "multilayer," "special processing," and "special materials." 【Specifications】 ■ Aluminum Core Wiring Board Insulation Layer - Thermal Conductivity: 5.0 W/m·K - Thickness: 120 μm - Young's Modulus: 33 GPa - Copper Plate Thickness: (0.2～) 0.5/1.0/1.5/2.0(～3.0) mm - Foil Thickness: 35/70(～200) μm *For more details, please refer to the PDF document or feel free to contact us.
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【Other Specifications】 ■ Copper Core Wiring Board Insulation Layer ・ Thermal Conductivity: 5.0 W/m·K ・ Thickness: 120 μm ・ Young's Modulus: 33 GPa ・ Copper Plate Thickness: (0.2～) 0.5/1.0/1.5/2.0 (～3.0) mm ・ Foil Thickness: 35/70(～200) μm *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Located in Chino City, Nagano Prefecture, we are a printed circuit board manufacturer that offers services from design to implementation on circuit boards, from prototype development products to mass production. We have extensive experience in thermal management boards and can propose the most suitable materials and structures for our customers' applications. Additionally, in recent years, we have also been accommodating thick copper boards for high current applications with various substrates.