Spatial distance and surface distance that cannot be measured in 3DCAD.
In inverter units where miniaturization and weight reduction are required and the structure is becoming more complex, ensuring the "insulation distance (spatial distance and creepage distance)" between busbars and other metal components as specified by safety standards has become a challenge. Distance measurements using "3D CAD" that do not meet the insulation distance requirements are inefficient and, more importantly, heavily reliant on human input, leading to issues such as measurement omissions and errors. 'XVL Studio Z' addresses these problems by utilizing the lightweight 3D data format "XVL"! 【What you can do with XVL Studio Z】 ■ Automatic extraction of combinations that need to be measured ■ Automatic measurement of spatial distance and creepage distance ■ Report output of verification results including path images *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Features】 ■ Overall interference, contact, and clearance checks of the product ■ Sharing of verification results ■ Bulk replacement of electronic component shapes ■ Electrical checks ■ Confirmation of change lists ■ Illustration creation ■ Ultra-lightweight & high precision ■ Multi-CAD compatibility ■ Provision of an easy-to-use plugin viewer ■ Viewing on iPad is possible with "iXVL Viewer" *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Purpose】 ■Overall evaluation of the product using 3D *For more details, please refer to the PDF document or feel free to contact us.
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![[XVL Studio Z Implementation Case] Nichicon Corporation Power Supply Center](https://image.mono.ipros.com/public/catalog/image_generated/01/07c/415306/415306_IPROS6235956525694993340_1.jpg?w=120&h=170)
Company information
"Strengthening the 'New Product Development Capability' of Manufacturing Companies" In an increasingly globalized market and manufacturing structure, it is no exaggeration to say that the biggest theme for our manufacturing clients at Zuken is "new product development capability." To broadly support our clients, Zuken continuously promotes research and development (R&D) with an eye on the future. The evolution of technology shows no signs of stopping. We aim to provide software and diverse services that enable the development of market-leading products, including cutting-edge devices that influence functionality, ultra-fine wiring technology, and advancements in operating frequencies from nanoseconds to picoseconds. Furthermore, to provide total support for our clients' manufacturing processes, we cover not only the electrical and electronic fields but also mechanical and structural design areas. We promote collaborative design of electrical and mechanical systems utilizing 3D data and the realization of digital mock-ups through data fusion. In 2007, Zuken established a support-focused subsidiary, CadLab Co., Ltd., and began offering proposals for 3D mechanical design CAD and designer CAE support. There is no other company that provides comprehensive solutions for design and manufacturing efficiency across semiconductors, printed circuit boards, and machinery/enclosures.
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