We evaluate abnormalities inside the device non-destructively.
In order to investigate the causes of device failures that cannot be identified through visual inspection, non-destructive evaluation methods such as X-ray CT may be necessary. Using X-ray CT, we measured the faulty transistor and checked its internal condition. As a result, we confirmed a wire breakage, and it was also found that the mold resin surrounding the broken wire had deteriorated due to heat and other effects at the time of the breakage.
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Analysis of electronic components.
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MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!