Detailed explanation of test results using multi-angular alumina particles of 1.2µm.
We would like to introduce a case where the strength of a hard, thin DLC film on a very soft Si wafer was evaluated without being influenced by the substrate. As a result, it was found that the erosion rate of the ultra-thin film was 0.002µm/g, and the strength was almost constant in both the three test areas and the depth direction. 【Case Summary】 ■Objective - Identification of the strength of hard ultra-thin films - Identification of the thickness of ultra-thin films - Exploration of the measurement capability of hard films on soft substrates ■Evaluation - It was found that the film thickness varied by area and matched the optical interference colors - Visualization of changes in strength at the interface, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Amid the significant trend of paradigm shifts, through creativity-driven research and development, we aim to propose new surprises—values and technologies, as well as next-level efficiency and quality—to our society, spreading all these surprises to the world and creating a vast network of "monozukuri" (manufacturing) and "kotozukuri" (value creation). We aspire to expand a network of manufacturing that encompasses the world, starting from Nagaoka, a city representing Niigata, a region known for its industrial development.
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