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  6. [Book] The Current State of Semiconductor Manufacturing Processes in the Approaching AI Era

[Book] The Current State of Semiconductor Manufacturing Processes in the Approaching AI Era

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BC190501

last updated:Dec 19, 2022

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Semiconductor manufacturing is changing with the rise of artificial intelligence! A detailed explanation of efforts towards cutting-edge LSI technology and key points of each manufacturing process!

★With the advancement of AI technology, the scope of semiconductor utilization is expanding. What semiconductor devices are required for applications in artificial intelligence such as deep learning? What is needed in the manufacturing process when considering integration with AI? What are the latest trends in equipment? ★Covering the latest processes such as 3D NAND, FOWLP, and movements towards miniaturization. A thorough explanation of technological advancements aimed at high performance! How far has technology progressed at this point? ★Innovation in semiconductor manufacturing processes through AI and data science. How is AI utilized in manufacturing processes? How is data science applied in inspections? What is smart manufacturing? As development speeds up, traditional methods cannot keep up! Let's introduce new ideas to prepare for a new era. ★Thoroughly grasping practical points and latest trends in each manufacturing process. Covering the latest technologies from ALD film deposition, EUV, DSA, NIL, to single-wafer cleaning! What are the key points for film deposition aimed at quality improvement? What are the key points for CMP and polishing? What cleaning methods prevent pattern collapse? What are the challenges of 3D integration? Important matters for each process necessary in practice will also be explained! ★Written by leading companies like Tokyo Electron, Toshiba Memory, and NVIDIA that are at the forefront of the times! Let's learn about the current state of semiconductor manufacturing processes.★

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[Book] The Current State of Semiconductor Manufacturing Processes in the Approaching AI Era

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Publication, Format, Price Publication: May 27, 2019, List Price: 54,000 yen + tax Format: B5 size, 259 pages, ISBN 978-4-86502-169-1 List of Contributors (Honorifics omitted) ● Atsugi Electronics: Toshio Kato ● Tokyo Electron Ltd.: Ki-shi Jeong ● Global Wafers Japan Ltd.: Haruo Sudo, Yuta Nagai, Koji Izumi ● NVIDIA: Toru Umaji ● National Institute of Advanced Industrial Science and Technology: Fumio Hara ● Someitec: Kengo Oozono ● PICOSUN JAPAN Ltd.: Daisuke Yahiro ● Osaka University: Masataka Endo ● Hitachi Ltd.: Kazunori Shinoda ● ISTL Ltd.: Akira Isobe ● Ibaraki University: Li-bo Zhou ● Office Shirami: Yoshimi Shirami ● Toshiba Memory Corporation: Hidenori Kakinuma ● Toshiba Memory Corporation: Hirokazu Ezawa ● EVE Group Japan Ltd.: Hiroshi Yamamoto ● Shibaura Institute of Technology: Kiyoshi Futagawa ● Omron Corporation: Yoshiyuki Nakamura

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54,000 yen + tax

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★Table of Contents A detailed table of contents more than five times the amount is currently available on the Information Organization's website! Chapter 1: Trends in Semiconductor Manufacturing Section 1: Trends in LSI Devices and Manufacturing Processes Section 2: Trends in Semiconductor Manufacturing Equipment Chapter 2: Key Points in Semiconductor Manufacturing in Response to Recent Trends in the Semiconductor Industry Section 1: Silicon Wafer Technology for Advanced Semiconductor Devices Section 2: Requirements for Artificial Intelligence Processors and Trends in Semiconductor Technology Section 3: Ultra-Compact Semiconductor Production Systems for Small-Batch, Diverse Products - Minimal Fab Chapter 3: Latest Trends and Key Considerations in Semiconductor Manufacturing Processes (Front-End) Section 1: Film Formation Section 2: Latest Trends in Lithography for Miniaturization Section 3: Cutting-Edge Dry Etching Technologies Section 4: CMP and Polishing Section 5: Latest Trends in Cleaning and Purification to Prevent Pattern Collapse Section 6: Cutting-Edge Semiconductor Manufacturing Processes Using AI Chapter 4: Semiconductor Manufacturing Processes (Back-End) and Inspection/Evaluation Section 1: Semiconductor Device Packaging Section 2: Wafer Bonding Section 3: Reliability Evaluation of Semiconductor Devices Section 4: Application of Data Science in Semiconductor Inspection

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