Suppress powder drop from the fracture surface! Compatible with various single-sided, double-sided, and multilayer printed circuit boards.
"Kyosha-MAX" is a method developed in-house that allows for the clear punching of printed circuit boards, suppressing powder drop from the fracture surfaces, which is one of the foreign materials mixed in. It can accommodate various materials for single-sided, double-sided, and multilayer printed circuit boards. 【Features】 ■ Maintains a clean environment by suppressing powder drop ■ No need for powder drop prevention treatment during assembly ■ Reduces powder scattering and adhesion in terms of quality *For more details, please refer to the external link page or feel free to contact us.
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basic information
【Comparison of Powder Loss】 ■Substrate: FR-1 ■Powder Loss (per 1m of fracture surface) ・Kyosha-MAX product: 0.84mg ・Conventional method product: 6.90mg →Powder reduction ratio compared to conventional product: 88% powder-free *For more details, please refer to the external link page or feel free to contact us.
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For more details, please refer to the external link page or feel free to contact us.
Company information
Kyosha Co., Ltd. provides one-stop solutions from PCB design to assembly. Our approach starting from board design allows for maximization of assembly efficiency and optimization of assembly conditions. We cater to both prototype development and mass production, so please feel free to consult us. Additionally, we support our customers' assembly needs with various assembly-related tools, including the highly acclaimed high-temperature adhesive carrier "MagiCarry" and flow soldering transport carriers.
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