Achieving cost reduction of curved aluminum substrates using screen printing technology! Capable of various three-dimensional processing!
Our "Bendable Aluminum Base Substrate" is a substrate that can be bent and retain its shape. It allows for 3D processing using plastic processing technology without cracking the insulating layer, enhancing design and design freedom. Additionally, it simultaneously achieves high insulation breakdown voltage and low thermal resistance. 【Features】 ■ The insulating layer does not crack even with 3D processing → Enables 3D processing using plastic processing technology ■ Bendable aluminum substrate that retains its shape → No need for attaching heat dissipation plates ■ Simultaneously achieves high insulation breakdown voltage and low thermal resistance → Achieves 7kV with an insulating layer of 25μm *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Layer Structure】 ■ Flexible solder resist ■ Rolled copper foil on copper foil ■ PI film insulation layer *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Automotive LED units (tail lamps, turn signals) ■ LED lighting ■ LED backlighting *For more details, please refer to the PDF document or feel free to contact us.
Company information
Kyosha Co., Ltd. provides one-stop solutions from PCB design to assembly. Our approach starting from board design allows for maximization of assembly efficiency and optimization of assembly conditions. We cater to both prototype development and mass production, so please feel free to consult us. Additionally, we support our customers' assembly needs with various assembly-related tools, including the highly acclaimed high-temperature adhesive carrier "MagiCarry" and flow soldering transport carriers.