Semiconductor device mounting bracket
This is a pressed product made from SPCC with a thickness of 1.6mm. After being punched out by pressing, it is bent in sequence and finished with chromate plating. This product is used as a mounting bracket for semiconductor equipment. The production time is approximately 3 to 5 days based on a lot of 1000 units.
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basic information
Material: SPCC / t=1.6 Dimensions: 44 × 88 Process: Press processing, Chromate plating Application: Semiconductor equipment mounting bracket
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Applications/Examples of results
This product is used as a mounting bracket for semiconductor devices.
Company information
If it's about manufacturing, leave it to Higashi Kai Manufacturing. We have the technical capability to solve difficult products that other companies have turned down. We can provide consistent support from various processing to plating, painting, and silk printing. With our quick response and sincere approach, we will turn your ideas into reality. Precision sheet metal / Can manufacturing sheet metal / Press processing / Machining / Resin cutting processing / Plastic processing / Various assembly processing / Sheet metal welding / Can welding / Development, design / Assembly, installation