Compact board 'TySOM-2' equipped with the largest class of the Zynq-7000 family.
TySOM-2 is a compact prototyping board manufactured with the XC7Z100 chip, which has the largest capacity in the Zynq 7000 family of devices. It utilizes the largest chip package (FFG900) with 362 I/O and 16 GTX transceivers, and features two FMC-HPC connectors that allow for the use of expansion daughter cards, ensuring maximum flexibility in peripheral selection.
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basic information
Basic Features FPGA - Xilinx Zynq-7000 XC7Z100 (FFG900) Memory - 1GB DDR3 - SPI Flash Memory (128Mb) - EEPROM (64 Kb) - MicroSD Card Slot Interface - HDMI 1.4 OUT - Gigabit Ethernet PHY (88E1116R) - 4x USB 2.0 Ports - UART to USB Bridge with Mini-USB B Type Connector (CP2103) - Xilinx JTAG Connector - 6x GPIO
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Applications/Examples of results
Field tests (FA, in-vehicle, IoT), prototypes, etc. AWS IoT Greengrass certified device: https://devices.amazonaws.com/detail/a3G0h0000088FZ6EAM/TySOM-2-7Z100-Embedded-Development-Kit
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Company information
Aldec Japan, Inc. is a leading EDA tool vendor in the industry, releasing innovative design creation, simulation, verification solutions, and a variety of development boards, which are adopted for the development of large-scale FPGA/ASIC/SoC and embedded system designs. The fields we are involved in span various areas, including telecommunications, automotive, educational and research institutions, and the aerospace industry. Please feel free to contact us if you have any inquiries.