SD card-sized exLeaf-p with MachXO3LF, featuring 4 sets of PMOD-configured GPIO, totaling 16 GPIOs.
Realization of Ethernet connectivity for sensor devices with the optional technology cores e7tcpip and e7udpip licenses - High-reliability network performance Due to being non-microcontroller based, it does not go down even under DoS/DDoS attacks, and processing is done with a unique H/W circuit, making it unmodifiable. - High-speed processing / low time lag Direct input and output of data using FPGA without a microcontroller (Processing is possible for each event: packet command, trigger event, time event, loop event) Example: Data collection (20nsec cycle) → Data processing → Packet generation → Socket transmission (120μsec cycle) - Fast startup Starts up and begins processing in about 3msec (excluding Link-Up) - Power-saving / space-saving Composed only of network I/F and FPGA Link-Up: 180mW Link-Down: 3.12mW SD card size (32mm × 24mm)
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basic information
FPGA Lattice Mach × O3 Size 32mm × 24mm (SD card size) Power Supply Passive PoE (5V) IP Core Includes UDP/IP core provided by e-trees.japan Development Environment Development possible with Lattice's Diamond (free)
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Applications/Examples of results
Product PR2 - Digital input/output over the network Control the values output to the GPIO ports J2 and J3 of exLeaf over the network using UDP packets. ⇒ Sample for reading values from J4 and J5 (digital input/output at https://e-trees.jp/exleaf) - Access to I2C/SPI/UART over the network Access I2C/SPI/UART devices over the network using UDP packets. ⇒ Sample I2C (I2C access at https://e-trees.jp/exleaf) ⇒ Sample SPI (SPI access at https://e-trees.jp/exleaf) ⇒ Sample UART (UART access at https://e-trees.jp/exleaf) Examples of use Acceleration sensor information transmission device, ultra-compact NTP (Network Time Protocol) server, display switcher, etc.
Company information
1) ODM Business (LED-related products, IoT-related systems / communication, imaging, medical devices, evaluation boards, etc.) ■ Contract services from product development to manufacturing 2) Special Substrate Business (Heat dissipation substrates, high current substrates, high-frequency substrates, power module substrates, etc.) ■ Sales through domestic and overseas manufacturing routes 3) Solution Business ■ Design / Manufacturing Solutions (Design, substrates, component procurement, prototype and mass production of assembly) ■ Business Solutions (Sales outsourcing, agency, infrastructure support, business succession support, etc.) ■ International Human Resource Introduction Solutions - Technical Intern Trainees (Vietnam) - Specified Skilled Worker No. 1 (Myanmar, Bangladesh, Sri Lanka) - Full-time Employees (domestic and overseas)
