Testing for the sheet-type plasma reflow device (fluxless reflow) is now open.
CtoC type plasma reflow device
Fluxless wafer bump reflow device. Achieves fine bump reflow without wet processes. Sample demo available. Reflow video posted.
Fluxless reflow in a strong reducing H2 radical atmosphere of damage-free downflow-type surface wave plasma, reducing flux application and cleaning processes, as well as application and cleaning equipment. A completely dry CtoC system. Achieving a short tact reflow process for fine pitch bumps.
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basic information
Charge-up damage-free process. Highly reliable and stable transport mechanism. Reflow temperature profile on a 300mm wafer with uniform temperature distribution. Supports full-scale mass production lines for 300mm wafers. Compatible with various upper communication standards, SMIFF pods, etc. Consistent team support from testing to design, delivery, and startup.
Price information
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Delivery Time
Applications/Examples of results
Wafer bump reflow Fine bump reflow on large substrates 300mm wafer single-sheet low-temperature annealing
Detailed information
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Illustration of the effect of process reduction for plasma flow devices.
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Illustration for print bump support
Line up（1）
| Model number | overview |
|---|---|
| Batch-type plasma flow device | Batch type compatible with 300mm wafers, deploying cutting-edge processes for niche devices. For R&D and small-scale production. |
catalog（3）
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Company information
Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.