Non-contact distortion and displacement measurement Digital Image Correlation method sDIC system

basic information

Digital Image Correlation (DIC) is a method that involves applying a random pattern called a speckle pattern to the surface of the measurement target, and by analyzing images before and after deformation, it measures strain and displacement, visualizing the deformation. It is also referred to as DIC, which is an abbreviation for Digital Image Correlation. Unlike strain gauges, it analyzes strain and displacement through image analysis, allowing for the visualization of surface and three-dimensional strain in a non-contact manner. Seika Digital Image has established a development system for the strain analysis software sDIC and specializes in proposing systems tailored to customer needs. There is 'sDIC 2D,' which uses a single camera for two-dimensional (xy) analysis, and 'sDIC 3D,' which uses two cameras for three-dimensional (xyz) analysis, including depth direction. Additionally, we offer standalone 'sDIC software' for those who already have an image acquisition environment, as well as a complete 'sDIC system' that includes cameras, lenses, fixtures, lighting, and analysis PCs.

Price range

P5

Delivery Time

Applications/Examples of results

Vehicle body and interior during operation Misalignment of engine and motor during operation, distortion of the case Vibration of the transmission during operation, misalignment and distortion of the housing Bulging during radiator pressurization, thermal deformation Deformation of brake pads during use Distortion of the arm under crane load Deformation of tire material under load Bending and tensile tests of hydrogen tank material (CFRP) Various tests including tensile, compression, bending, and thermal tests Various metals and solder, carbon materials Film and plastic resin materials Carbon materials (CFRP) Composite materials Deflection of bridges during vehicle passage Vibration of handrails and wind deflectors due to wind Vibration and deformation of piping Physical property evaluation of vibration-damping rubber Vibration of air conditioning housing, distortion of the compressor Deformation during destruction testing when a camera falls Temperature changes of wafers, destruction test analysis Temperature changes of electronic circuit boards, test analysis under pressure Temperature changes of capacitors Tensile, compression, bending, vibration, temperature changes High-speed testing Repeated testing, fatigue testing Micro tests under a microscope and electron microscope