Dual antenna built-in LoRa ・BLE module
ISP4520-AS (Japan compatible product) ISP4520-EU (Europe compatible product) ISP4520-US (USA compatible product)
LoRa+BLE combo module. Compatible with frequencies for various countries. 9.8 x 17.2 x 1.7 mm. Built-in dual antennas. Radio certification obtained.
Despite its small dimensions, it incorporates two SoCs: the LoRa component (Semtech's SX1261) and the BLE component (Nordic Semiconductor's nRF52832), along with antennas and matching circuits for both 920MHz and 2.4GHz frequencies within the same package. This minimizes high-frequency analog design, enabling stable communication performance. While maintaining LPWAN compatibility and an optimal configuration for private LoRa, it allows easy connection to smartphones through its internal BLE functionality for data transmission and firmware over-the-air updates. With industry-leading dimensions of 9.8 x 17.2 x 1.7 mm and built-in dual antennas, it can be used for a wide range of applications as a compact IoT device. A development evaluation kit is also available, which includes a sample module, an interface board for PC development, sample software, and source code, allowing for immediate product development. It has obtained domestic radio certification, and frequency-compatible modules for the European and American markets are also available.
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basic information
LoRa protocol stack and BLE BT Ready stack built-in External antenna connection is also possible.
Price range
Delivery Time
※For small quantities, shipping is possible in about 2 weeks.
Applications/Examples of results
A wide range of IoT communication fields including sensor nodes, gateways, human tracking, and environmental sensor communication.
Company information
The French headquarters Insight SiP has been providing the industry's smallest class of wireless modules, equipped with patented technology and built-in compact antennas, for customers requiring essential solutions in the IoT field such as BLE, LPWA (LoRa, NB-IoT), ranging, UWB, and BT positioning communication for many years. The wireless modules on sale incorporate all necessary components for operation, including a wireless chip (SoC), crystal, and DC/DC converter, and operate simply by connecting to an external power source and sensor data. Combo modules like LoRa and UWB integrate multiple wireless chips and antennas, minimizing not only the need for high-frequency antenna design by customers but also reducing BOM and board space. Mass production is outsourced to local factories in Taiwan or the Philippines with proven track records. Development environments, including development kits and firmware for each product, are also provided, allowing developers to bring products to market in the shortest time without starting from scratch. The products obtain radio certifications from various countries and certifications from related organizations, facilitating the certification acquisition process for customers.
