DPGA is made double-sided and supports back-side wiring! Equal-length wiring is possible even when parallel circuits are present.
"DPGA-M" is a high thermal conductivity substrate that features a single-sided multilayer design and supports backside wiring. By adopting a single-sided multilayer structure, it significantly enhances design flexibility, allowing for backside wiring. Although it has multiple layers stacked on one side, it is possible to penetrate copper bumps. This enables direct connection of high thermal conductivity components to the copper base and heat sink. 【Features】 ■ Single-sided multilayer structure ■ Enables backside wiring ■ Allows for equal-length wiring even in the presence of parallel circuits ■ Significantly increases design flexibility ■ Enables direct connection of high thermal conductivity components to the copper base and heat sink *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
With the diversification and high performance of products, electronics are rapidly advancing towards high performance and high heat dissipation. They are used in various applications such as televisions, computers, and digital cameras, and are not only common products but also widely utilized as core components in medical devices and information communication equipment. In addition to the obvious requirements of QCD (Quality, Cost, Delivery), the importance of environmental pollution countermeasures is increasing, making it urgent to address these issues. To meet the needs of a changing era and as a means to tackle environmental problems, Daiwa Industry Co., Ltd. has developed and patented its unique technology "DPGA (New AGSP)" and is providing this technology to the industry, continuously working towards making it the industry standard. As a first step to address environmental issues, we have achieved energy-saving solutions through high heat dissipation substrates. We offer technologies and products that can accommodate various solutions, including heat dissipation, and can provide a consistent solution from prototype to mass production. We look forward to your continued support for Daiwa Industry's DPGA.