Embed copper pins directly under the heating components! This can reduce the cost difference based on the number of copper pins.
"DPGA-EF" is a type of substrate that embeds copper pins only in the necessary areas. It can be produced at a lower cost compared to copper bases with bumps. The copper pins are inserted into the holes of the rigid substrate and fixed with resin. Unlike press-fitting, there is no risk of cracks or other issues. Additionally, the copper pins are embedded all at once. Unlike the press-fitting method, the cost difference based on the number of copper pins can be minimized. 【Features】 ■ Both sides of components can be mounted ■ Heat-generating components can be cooled precisely ■ There are no concerns about cracks or chemical residue, as it differs from the copper pin press-fitting method ■ It can be produced at a lower cost compared to copper bases with bumps ■ Unlike the press-fitting method, the cost difference based on the number of copper pins can be minimized *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications】 ■Minimum board thickness: 0.2mm ■Copper pin diameter: 0.5 to 6.0mm ■Copper pin shape: Customizable (e.g., round, square) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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With the diversification and high performance of products, electronics are rapidly advancing towards high performance and high heat dissipation. They are used in various applications such as televisions, computers, and digital cameras, and are not only common products but also widely utilized as core components in medical devices and information communication equipment. In addition to the obvious requirements of QCD (Quality, Cost, Delivery), the importance of environmental pollution countermeasures is increasing, making it urgent to address these issues. To meet the needs of a changing era and as a means to tackle environmental problems, Daiwa Industry Co., Ltd. has developed and patented its unique technology "DPGA (New AGSP)" and is providing this technology to the industry, continuously working towards making it the industry standard. As a first step to address environmental issues, we have achieved energy-saving solutions through high heat dissipation substrates. We offer technologies and products that can accommodate various solutions, including heat dissipation, and can provide a consistent solution from prototype to mass production. We look forward to your continued support for Daiwa Industry's DPGA.