We introduce a thick copper substrate that incorporates a 400μ copper plate bonded to the core material, accommodating multilayer configurations.
The "High Current Compatible Thick Copper Substrate" is a substrate that consists of a core material bonded with a copper plate as the outer layer. The thickness of the outer layer copper can be up to 400μ. It is designed to accommodate high current applications. Additionally, it can also support multilayer boards where copper plates are bonded to the inner layers, with only the outer layer being thick copper. Thick copper can be used for both outer layer circuits and inner layer circuits. 【Features】 ■ A 4-layer board combining 35μ inner layer with 300μ outer layer ■ Compatible with the step of thick copper through silk printing with inkjet *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Specifications】 ■Outer layer copper thickness: 100um (105um), 200um, 400um ■Material: Copper foil, copper plate, copper plate *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
With the diversification and high performance of products, electronics are rapidly advancing towards high performance and high heat dissipation. They are used in various applications such as televisions, computers, and digital cameras, and are not only common products but also widely utilized as core components in medical devices and information communication equipment. In addition to the obvious requirements of QCD (Quality, Cost, Delivery), the importance of environmental pollution countermeasures is increasing, making it urgent to address these issues. To meet the needs of a changing era and as a means to tackle environmental problems, Daiwa Industry Co., Ltd. has developed and patented its unique technology "DPGA (New AGSP)" and is providing this technology to the industry, continuously working towards making it the industry standard. As a first step to address environmental issues, we have achieved energy-saving solutions through high heat dissipation substrates. We offer technologies and products that can accommodate various solutions, including heat dissipation, and can provide a consistent solution from prototype to mass production. We look forward to your continued support for Daiwa Industry's DPGA.