Flexible bonding function! With Y and Z motor drive, it offers easy operability.
The "MODEL53 Series" is a wire bonder that allows for switching between wedge bonding and ball bonding without changing the head. It is equipped with flexible bonding capabilities, a variety of loop control functions, and a double clamp feature. With digital weight control and Y, Z motor drive, it offers easy operability. 【Features】 ■ Capable of both wedge and ball bonding ■ Y, Z motor drive ■ Easy operability ■ User-friendly system ■ Digital weight control *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Other Features】 ■High reliability bonding ■Diverse loop control functions ■Double clamp function ■Various customization options *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
Line up（5）
| Model number | overview |
|---|---|
| MODEL5310 | Ball Bonder |
| MODEL5330 | Standard Fine Wire Wedge Bonder |
| MODEL53xxBDA | Ball Bonder/Deep Access Wedge Bonder |
| MODEL5350 | Thick Wire Bonder for Power Devices |
| MODEL5350HR | Thick Ribbon Bonder for Power Devices |
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Company information
At Eltech Co., Ltd., we provide semiconductor manufacturing equipment utilizing cutting-edge technology, including wire bonders, ultrasonic oscillators, and bonding tools. We offer a range of products starting with the tabletop semi-automatic wire bonder "MODEL 56i series," as well as the MODEL 53 series manual wire bonder for research and development/small-scale production purposes, and the M17 automatic wire bonder for production applications. Please feel free to contact us if you have any inquiries.