Revasum's wafer processing equipment! It offers improved yield for SiC substrates and devices.
The "6EZ" is a fully automatic dry-out polish device that can improve the yield of SiC substrates and devices. By using Revasum's 7AF-HMG grinder and 6ZE polish device simultaneously, we provide process simplification. As an import and export trading company for semiconductor manufacturing equipment and precision parts for equipment, we actively seek innovative technologies worldwide and quickly propose products that meet our customers' needs. 【Features】 ■ Compatible with 150mm and 200mm ■ Dry-in, dry-out ■ Supports single-side and double-side polishing ■ Target polish rate of 10μm/hour ■ Provides surface flatness of ≦1Å with 1μm removal *For more details, please refer to the PDF document or feel free to contact us.
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We are a trading company that provides the sale of semiconductor manufacturing equipment, inspection equipment, and components for semiconductor manufacturing both domestically and internationally, as well as technical support and cost reduction in device manufacturing.