~From basic composition to manufacturing, evaluation, formulation design technology, and future advanced development guidelines~
Sealant materials and raw material manufacturers, sealant material manufacturing equipment and sealant process equipment manufacturers To those in charge of development and manufacturing technology at user companies of sealant materials and companies considering new entries— This is a bible that details the past and future of sealant materials along with specific and practical technical information. ■ Expectations for new materials and technologies are rising in semiconductor sealing, entering a transformative era ~From EMC (solid materials and tablet products) to new materials such as inks, films, and powders~ - The emergence of new PKG types such as FO-type packages (PKG) and three-dimensional modules is changing the sealing targets. - The focus is shifting from traditional chips to sealing connection circuits (substrates and rewiring). ■ Thoroughly understand sealant materials! Practical and specific technical information related to the development and manufacturing of sealant materials ~Detailed explanations incorporating the author's experiences, experimental notes, and actual process diagrams~ - The development history of sealant materials in line with the evolution of PKG shapes, mounting methods, and sealing methods. - Requirements for resin sealing methods such as various molding methods, casting, dipping, dripping, and immersion methods. In addition, the "Column" section includes business customs and company information in the semiconductor and sealant material industries, as well as development experiences.
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■Author Shigeru Koshibe, President, Aipack Co., Ltd. ■Table of Contents Part 1: Basic Information on Semiconductor Encapsulation Methods and Materials Chapter 1: Overview of Resin Encapsulation and Encapsulation Materials 1. Overview of Semiconductor Resin Encapsulation Technology 2. Encapsulation Materials 3. Types and Applications of Encapsulation Materials Chapter 2: Basic Composition of Encapsulation Materials and Manufacturing Parameters and Evaluation Methods 1. Background of Composition Consideration 2. Basic Composition of Encapsulation Materials 3. Manufacturing Parameters of Encapsulation Materials Chapter 3: Raw Materials for Encapsulation Materials 1. Fillers 2. Epoxy Resins 3. Hardening Agents 4. Hardening Catalysts 5. Other Raw Materials Part 2: Design of Encapsulation Materials and Future Development Guidelines Chapter 4: Design of Encapsulation Materials 1. Basic Considerations 2. Core Technologies 3. Individual Technologies 4. Analysis of Encapsulation Materials Chapter 5: Future Development Guidelines for Semiconductor Encapsulation Materials 1. Cutting-edge Semiconductor Packaging 2. High-speed Semiconductor 3. Miniaturization of Mixed Components Packaging 4. Element Technologies for Next-generation Packaging 5. Power Devices
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