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  5. Reflow Equipment
  6. High Power Preheater Unit MPH1000

High Power Preheater Unit MPH1000

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Preheater Unit MPH1000

last updated:Sep 04, 2024

メイショウ
メイショウ
  • Official site

A large-capacity preheating unit that supports extremely thick large PCBs. Are you having trouble with insufficient thermal capacity in your current preheater?

The high-power preheater unit MPH1000 is an ideal preheater unit for customers who are struggling with insufficient thermal capacity during preheating or are dissatisfied with slow heating ramp-up speeds. - Achieves ample heating and a wide heating range with a large-capacity far-infrared heater - Capable of heating L-type PCBs and large multilayer boards (MAX 400mm×500mm) - Prevents heating damage to PCBs during post-application or correction of lead-free solder - Can be used as a hot plate - Suppresses twisting and local expansion due to temperature variations - Provides high uniformity in preheating (proven unique heater arrangement) - Employs a fast-starting far-infrared heater - Achieves high-precision temperature control - Capable of reballing heating regeneration for BGA and CSP single items/mass production - Suitable for auxiliary heating with solder wick for residual solder removal These are some of its features. If you are having trouble with conventional preheaters, please give it a try.

    Reflow Equipment
mph1000-ipro.jpg

High Power Preheater Unit MPH1000

mph1000-ipro.jpg
mph1000-ipro.jpg
  • Related Link - http://www.e-meisho.co.jp/

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basic information

Target substrate size: Maximum 400×500mm (please consult separately for substrates larger than this) Target substrate thickness: Maximum 4mm (up to 8mm available as an option) Maximum substrate weight: Approximately 3.0Kg Maximum component height: 25mm (max) from the underside of the substrate Temperature control: PID type For any other details, please feel free to contact us.

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Applications/Examples of results

- Achieves ample heating and a wide heating range with a high-capacity far-infrared heater - Prevents heating damage to the PCB during post-soldering and corrections with PB-free solder - Can be used as a hot plate - Suppresses twisting and localized expansion due to temperature variations - Allows for reball heating regeneration of BGA and CSP single items and mass-produced products - Suitable for auxiliary heating with solder wick for residual solder removal

Company information

メイショウ

メイショウ

Industrial Machinery

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Meishou believes that developing products that can respond in real-time to the international information society and always be a pioneer of the times is what makes one a pioneer of the new era. One answer to this is our company philosophy of "products that delight our customers and gratitude." It is about creating the best products, gaining the best trust through the best service. With this philosophy, we have developed various products that contribute to society. Moving forward, we will continue to challenge the new generation through research and development of foundational technologies that support informationization, and we will create the best products that match market needs.

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