Simple, compact, high-performance; ideal for experiments and basic research; flexibly customizable according to user needs; standard-type deposition device.
Covers all performance, cost, and technical support required for basic research, and can be customized according to individual requirements.
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basic information
A fully manual deposition system equipped with a standard dual-source resistance heating evaporation source. Flexible support for substrates ranging from Φ2 to 3-inch wafers to special substrates. Abundant options such as additional evaporation sources, simultaneous deposition, substrate cooling, and high-temperature heating mechanisms. Sample testing available with in-house demonstration equipment.
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Applications/Examples of results
Research for universities and public research institutions: compound semiconductor research and development, metal surface treatment, electronic materials research.
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| Model number | overview |
|---|---|
| AMF-850SPB Type | This is a research and development front-door type deposition device equipped with an electronic gun, capable of forming films of high melting point metals and oxide films. It has a wealth of proven results, characterized by stable film formation performance and flexible customization options due to its rich array of optional features. |
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Company information
Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.
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