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  6. [Data] Non-contact thickness and shape measurement sensor

[Data] Non-contact thickness and shape measurement sensor

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last updated:Mar 30, 2022

プレシテック・ジャパン
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Many measurement examples are included! We are introducing CHRocodile's applications for semiconductors.

This document provides information about non-contact thickness and shape measurement sensors. It introduces topics such as "The Principle of the CHROMATIC VISION CAMERA," "Measurement Examples," and "Features and Advantages of CHRocodile." Please take a moment to read it. 【Contents (Excerpt)】 ■ White Light Sensor ■ CHRocodile C ■ Interference Sensor ■ CHROMATIC VISION CAMERA ■ FLYING SPOT SCANNER *For more details, please refer to the PDF document or feel free to contact us.

    SensorsOptical Measuring Instruments
2019-12-19_10h56_17.png

[Data] Non-contact thickness and shape measurement sensor

2019-12-19_10h56_17.png
2019-12-19_10h56_17.png
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【Other Publication Contents (Excerpt)】 ■Example 1: Si thickness measurement data during wafer in-process: Spectroscopic interference type Si thickness ■Advantages of wafer in-situ process based on the principle of spectroscopic interference ■Example 2: Si thickness measurement data during wafer in-process: Step height (thickness) using chromatic aberration confocal ■Advantages of wafer in-situ process based on the principle of chromatic aberration confocal ■Measurement Example 3: Shape measurement of bump wafers *For more details, please refer to the PDF document or feel free to contact us.

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[Keywords: Applications, Measurement Items, Benefits, etc.] Non-contact, optical sensor, confocal, spectral interference method, thickness, thin film, thick film, gap, height, surface roughness, flatness, TTV, shape, appearance, edge, slope, measurement, inspection, high speed, 3D, line sensor, line scan, area scan, full surface, compact, inexpensive, high precision, inline, monitoring, in-situ, during processing, before and after processing, polishing, offline, tabletop machine, sampling, embedded, semiconductor, wafer, wafer bonding, Si wafer, Si, GaAs, InP, SiC, LiNbO3 (LN), LiTaO3 (LT), GaN, SiP, Al2O3 (sapphire), CMM, weld joint, glass, quartz glass, silicate glass (medical ampoules), display glass, car windshield, PCB, medical balloon, barrier film, PET film, coating, film, multilayer film, applied film, conformal coating, electrode layer coating, stent coating, polyimide, PVB, resin material, flux, adhesive, insulating film, air layer, dicing groove, flip chip, wire bond, micro bump, transparent, transparent body, black, glossy, mirror finish, easy.

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[Data] Precitec Presentation: Measurement Examples for Semiconductors

[Data] Precitec Presentation: Measurement Examples for Semiconductors

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Thickness measurement application

Thickness measurement application

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プレシテック・ジャパン

プレシテック・ジャパン

Testing, Analysis and Measurement

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Presitech is a specialist in laser material processing and optical measurement technology. We are not just a supplier of systems and components, but a professional partner in ensuring a smooth processing process for our customers. We offer consultations from the foundational stage and accurately consult with customers on their requests and objectives. We understand that the key to success in unique processing processes lies in the four components of exhibition, monitoring, processing, and control. Only by doing so can we provide appropriate solutions for our customers' applications. Our high-quality products, such as laser processing heads, quality monitoring systems, and optical measurement systems for spacing/thickness measurement, allow customers to directly benefit from our decades of experience. Our optical sensors are characterized by the highest precision and dynamic adaptability. Furthermore, they detect accurate values even in high-speed measurements.

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