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  6. Reliability and improvement technologies for in-vehicle devices.

Reliability and improvement technologies for in-vehicle devices.

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last updated:Dec 29, 2019

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Explaining the challenges, required characteristics, and approaches and technologies for improving the reliability of automotive electronic devices (wire harnesses, connectors, power devices, etc.) connections.

This book focuses on the interconnection of electronic products that support various electronic systems required for CASE vehicles. The physical connections are still primarily dominated by connectors, and it is not an exaggeration to say that their reliability significantly affects the reliability of the vehicle. Therefore, we will focus on the topic of connecting electronic products, primarily explaining it from a hardware perspective. Chapter 1 provides an overview of in-vehicle reliability and the approach to addressing it. Chapter 2 covers a wide range of cutting-edge technologies required for connectors, from high-voltage connectors to those in the high-frequency domain, including basic technologies, contact materials, and surface plating techniques. Chapter 3 examines the technology and reliability related to component mounting techniques within each electronic product. First, it is essential to thoroughly understand the concepts and evaluation techniques for ensuring reliability in soldering technology. Building on that, we detail high-reliability design in the mounting technology of power devices used in inverters, which are key players in electrification. The recent trend shows that vehicle usage years are increasing, and electronic products are increasingly required to have longer lifespans. The longevity of solder joints is evolving not only in structural design and process implementation technologies but also in solder materials and the circuit board materials that house electronic components, with the results of various material research also being introduced.

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Reliability and improvement technologies for in-vehicle devices.

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Published on January 8, 2020 A4 size, paperback, 170 pages <Supervision> Arihiro Kamiya / Denso Corporation <Authors> Tsuneo Ajioka / Fault Material Properties Solutions (Vice Chair of the Fault Material Properties Research Committee of the Japan Society for Reliability Engineering) Arihiro Kamiya / Denso Corporation Mio Mizutani / Auto Network Technology Research Institute (Sumitomo Electric Group) Naotsugu Serizawa / Yazaki Corporation Kaito Kondo / Hoshiden Corporation Yoshifumi Kaku / Denso Corporation Yasuhiro Kotani / Denso Corporation Ryuichi Nakajima / Oki Engineering Corporation Yoshiyuki Nishimura / OM Industry Corporation Minoru Hiramatsu / OM Industry Corporation Kouya Nomura / Kobe Steel, Ltd. Satoshi Shimizu / National Institute of Information and Communications Technology Shotaro Ishino / Furuno Electric Co., Ltd. Qiang Yu / Yokohama National University You Tanaka / Mitsubishi Electric Corporation Koji Yamazaki / Mitsubishi Electric Corporation Shunsaku Yoshikawa / Senju Metal Industry Co., Ltd. Keisuke Kushida / Hitachi Chemical Co., Ltd.

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60,000 yen Plus consumption tax *With CD-R is 70,000 yen + consumption tax

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P2

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P3

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Chapter 1: Reliability Requirements for Automotive Electronic Devices: Prevention and Analysis of Failures Chapter 2: Improving Connection Reliability and Evaluation Techniques for Harnesses, Connectors, and Terminals Section 1: Required Characteristics and Reliability Improvement Techniques for Automotive Connectors Section 2: High-Voltage Harnesses and High-Voltage Connectors for Electrified Vehicles Section 3: Optical Fibers for In-Vehicle Optical Networks Section 4: High-Speed Transmission Connectors and Harnesses for Automotive Use Section 5: Automotive Ethernet Communication Technology Section 6: Reliability Evaluation Techniques for Automotive Harnesses and Connectors Section 7: Surface Treatment Techniques for Connector Terminals Section 8: Reliability and Environmental Resistance of Copper Alloys and Surface Treatments for Automotive Terminals Section 9: Wireless Harness Technology Section 10: Harnessless Technology Using Radio Wave Hose Chapter 3: Improving Connection Reliability and Evaluation Techniques for Automotive Electronic Components and Power Modules Section 1: Connection Reliability Techniques for Automotive Electronic Components Section 2: Reliability Challenges and Evaluation Methods in Automotive Electronic Device Assemblies Section 3: Reliability Design of Power Module Joints Section 4: Joining Techniques Using Solder Dipping Method for Aluminum Wires Section 5: High-Reliability Solder Materials for Automotive Use Section 6: Solder Crack Suppression Substrate Materials for Automotive Applications

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Connection reliability and improvement technologies for onboard devices.

Connection reliability and improvement technologies for onboard devices.

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