Directly mount semiconductor components onto the solder of PCB surface electrodes! Chip components and irregularly shaped components can be mounted on the surface of the PCB!
We would like to introduce the SMT process technology of Niigata Seimitsu Co., Ltd. In the SMT process, we accommodate high-density and closely spaced mounting, and we can also handle solder repair. Furthermore, we are capable of providing the necessary circuit board design for high-density and closely spaced mounting. Additionally, we can comprehensively handle other processes related to the SMT process, such as circuit board cleaning, dicing, and underfill, all in-house. 【Features】 ■ Printing paste solder on the electrodes of printed circuit boards (PCBs) ■ Directly mounting semiconductor components, etc., onto the solder on the PCB surface electrodes ■ Solder connection methods ■ Lead-free solder compatibility ■ Capability to mount chip components and irregular components on the PCB surface *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications (Excerpt)】 ■ Chip Size: 0402 size and above ■ Ball Pitch: 0.3mm pitch and above for WLCSP ■ Irregular Components: Connectors, etc. ■ Types of Substrates: Glass epoxy substrates, rigid substrates, flexible substrates, ceramic substrates ■ Substrate Size Max: 330(L) × 250(W) mm (Medium size) Min: Usable with transport carriers, etc. ■ Solder Used: Lead-free solder (solder composition, etc., negotiable) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Niigata Seimitsu Co., Ltd. primarily develops SMS business and is engaged in the overall development design, manufacturing, and maintenance of electronic devices and more. We possess various implementation technologies, development/design technologies, and evaluation/analysis technologies, so please feel free to consult us if you have any requests.
