Stress simulation service (analysis) vibration, impact, drop, durability

Are you struggling to respond to issues with the temperature cycle testing of your products? (Analysis) Vibration, shock, drop, durability.

The "Stress Simulation Service" uses a model that takes package structure into account to improve lifespan in temperature cycle testing. (Analysis) Vibration, impact, drop, durability In temperature cycle simulation, lifespan predictions are made through simulations that consider package structure, and improvement proposals aimed at reliability are suggested. Additionally, in vibration simulation, issues caused by vibrations during transport and operation are resolved, while drop and impact simulations address problems related to drop impacts on semiconductor component connections. 【Features】 ■ Improvement of lifespan in temperature cycle testing using a model that considers package structure ■ Reduction of loss costs in the range of millions of yen caused by additional prototypes and evaluations ■ Resolution of issues caused by vibrations during transport and operation (actual usage conditions) ■ Resolution of issues related to drop impacts on semiconductor component connections (solder) *For more details, please refer to the PDF document or feel free to contact us.

Vibration TestingImpact TestOther contract services