Compatible with 10,000 cP polyimide and resist! ASAP is a manufacturer specialized in high-viscosity resist and chemicals.
We have strengths in the application of high-viscosity resist! For example, we can achieve an in-plane uniformity of ±5% or better even with resists over 400 cP (φ300mm wafer). Our patented ASAP (A.S.A.P.) rotating cup method allows for uniform and high-quality thick film application (Patent No. 3821468). This product is equipped with spin coating, HMDS treatment, baking, and cooling functions. We offer a lineup tailored to production volume, ranging from manual machines to fully automatic machines, and since we handle everything from design to manufacturing and sales in-house, we can offer low prices. We have a proven track record with a variety of chemicals, including polyimide, SOG, WAX, and silicone. 【Features】 ■ Achieves low prices ■ Automatic wafer size detection function ■ Proven track record with various chemicals ■ Reduced footprint ■ Numerous options with low resist usage ■ Lineup tailored to production volume * For more details, please refer to the PDF document or feel free to contact us. We also have demo equipment available, so if you're interested, please consider a free demo!
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basic information
【Main Specifications】 ■ Cassette Stage: 2 sets ■ Spin Coating Unit: 2 sets ■ Wafer Size: Φ2" to Φ12" ■ Resist Dropping Nozzle: 2 sets ■ Bake Unit: 2 sets (Max 200℃) ■ Cooling Unit: 1 set ■ Centering Unit: 1 set ■ Equipment Size: (Example) 1200×1000×1800 (Φ4" main body) 1600×2500×1800 (Φ12" main body) ■ Wafer Transport Robot: 1 set (Double Arm Clean Robot) Many other options available! *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.