Standard series for electronic device applications. A reliable and comprehensive lineup ranging from multipurpose small research units for R&D to mass production for well-established back electrode applications.
A lineup of standard deposition equipment that broadly supports everything from research and development of semiconductors, MEMS, and various electronic components (sensors, quartz oscillators, etc.) to full-scale mass production. All models are compatible with clean rooms and clean vacuum environments, equipped with various selection mechanisms. We respond meticulously to individual requests based on our extensive experience with standard specifications. Customization is available for evaporation sources, heating temperatures, substrate mechanisms (planetary dome, rotary dome), operation, and logging software. We also offer process testing with in-house demo units, providing a wide range of flexible hardware and support.
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basic information
All models compatible with clean room BOX type 10 kW electron gun equipped, compatible with high melting point metals and oxides Combined with resistance heating electrodes, compatible with multilayer films and alloys (optional) Dome and wafer fixtures compatible with thin wafers High-temperature heating (back electrode sintering) and cooling (compatible with lift-off process) tailored to the process Substrate mechanism changes to accommodate not only wafers but also ceramic and glass substrates
Price information
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Delivery Time
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Applications/Examples of results
Formation of discrete linear IC back electrodes Formation of compound semiconductor electrodes Formation of quartz crystal oscillator electrodes Resistive film deposition
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Company information
Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.
