Standard device for voidless soldering. Proven and reliable hardware and software supporting automotive power device modules.
Expanding a batch-type vacuum soldering device with a rich track record for full-scale mass production. In addition to the conventional H2 atmosphere process, support for formic acid has been added. Achieving voidless soldering with higher reliability on the mass production line. A standard device for soldering automotive power device modules. Responding to requirements with process support from in-house demo units and flexible hardware solutions.
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basic information
Equipped with a rapid temperature rise and fall mechanism and precise atmosphere control mechanism, it achieves stable supply and management of formic acid with a gas supply mechanism proven in semiconductor wafer processes. A substrate transport mechanism has been added before and after the soldering chamber, achieving both high throughput and a high level of void-free soldering. Optimal hardware is provided according to the substrate, line configuration, and production volume.
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Applications/Examples of results
Mass production of automotive power device modules Mass production of power control element soldering
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Company information
Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.
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