Stable thermal conductivity of over 600 W/(m·K)! Capable of high-temperature (800℃) silver brazing.
"Ag-Diamond" is a composite material of silver and diamond. It has a higher thermal conductivity (600W/(m·K)) than "Cu-Diamond" and is applicable for large area applications of 50×50mm². In addition to being able to be plated with Ni or Ni/Au on the surface, it also supports high-temperature (800℃) silver brazing. 【Features】 ■ Stable high thermal conductivity of over 600W/(m·K) ■ Surface can be plated with Ni or Ni/Au ■ Supports high-temperature (800℃) silver brazing *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Properties (Representative Values)】 ■ Thermal conductivity: >600W/(m・K) ■ Coefficient of thermal expansion ・R.T.-400℃: 9.0ppm/K ・R.T.-800℃: 10.5ppm/K ■ Thermal conductivity after heat treatment at 800℃: No change ■ Specific gravity: 5.9 ■ Specific heat: 0.34 kJ/kg・K ■ Young's modulus: 340GPa ■ Poisson's ratio: 0.24 *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Application Examples】 ■Artificial Satellites ■Ag-Diamond Heat Sink *For more details, please refer to the PDF document or feel free to contact us.
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Allied Material Co., Ltd. was established in 2000 through the merger of Tokyo Tungsten Co., Ltd. and Osaka Diamond Industrial Co., Ltd. Since then, we have steadily grown as a part of the Sumitomo Electric Group's industrial materials division, with the refining, material manufacturing, and processing technology of high melting point metal materials such as tungsten and molybdenum, as well as the manufacturing and precision processing technology of diamond precision tools as the two pillars of our business. We will continue to strive to create new added value based on our core technologies in order to survive alongside our customers in the rapidly changing market environment that is expected in the future, and we will continue to challenge ourselves to provide even higher satisfaction.