Laser microfabrication: Trimming of polyimide using ultrashort pulse lasers.
【Microfabrication Trimming Micron Level Polyimide】 【Material】 Polyimide 【Industry and Applications】 Semiconductors Electronic Components 【Material Dimensions】 Plate Thickness: 25μm Remaining Width: 10μm 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product is made of polyimide material. Trimming processing was performed on polyimide with a thickness of 25μm. The remaining width is 10μm. Since this product uses ultrashort pulse lasers, physical damage and thermal effects are greatly minimized, allowing for fine processing with minimal burrs. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor components ◆ Prototype and development projects Leave it to us. We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 511 Room, Tokatsu Techno Plaza, 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture 277-0882 Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/
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【Microfabrication Trimming Micron Level Polyimide】 【Material】 Polyimide 【Industry/Application】 Semiconductors Electronic Components 【Material Dimensions】 Thickness: 25μm Remaining: 10μm 【Processing】 Ultrafast Pulse Laser Processing 【Features】 This product is made of polyimide material. Trimming processing was performed on polyimide with a thickness of 25μm. The remaining width is 10μm. Since this product uses ultrafast pulse laser, physical damage and thermal effects are significantly minimized, allowing for fine processing with minimal burrs. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects Leave it to us. We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 511 Room, Tokatsu Techno Plaza, 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture, 277-0882 Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/
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【Microfabrication Trimming Micron Level Polyimide】 【Material】 Polyimide 【Industry and Applications】 Semiconductors Electronic Components 【Material Dimensions】 Plate Thickness: 25μm Remaining Width: 10μm 【Processing】 Ultrafast Pulse Laser Processing 【Features】 This product is made of polyimide. Trimming processing has been performed on polyimide with a thickness of 25μm. The remaining width is 10μm. Since this product uses ultrafast pulse laser, physical damage and thermal effects are minimized, allowing for fine processing with minimal burrs. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects Please leave it to us. We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture 277-0882, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/
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At "HIKARI LASER LAB.", we offer services for precision processing using ultra-short pulse lasers, including "contract processing," "development agency," and "marking." Precision processing and surface modification/internal marking using picosecond and femtosecond lasers are utilized in various industrial equipment across sectors such as the medical industry, automotive industry, and semiconductor industry. Recently, there has been a demand for surface modification not only for shape processing like fine hole drilling, cutting, trimming, and groove processing but also for enhancing functionalities such as water repellency, release properties, friction reduction, and improved sliding properties. Additionally, there is a demand for marking inside glass from the medical industry. Laser processing is possible on a wide range of materials, including transparent materials like glass and diamonds, difficult-to-cut materials like titanium, and resins, CFRP, ceramics, and polyimides. Regarding surface modification, we have received requests to improve the release properties of molds. We will continue to "challenge" ourselves in precision processing and surface modification using ultra-short pulse lasers to meet our customers' needs!