A scrubber that employs a high-pressure jet with numerous proven results. When combined with a soft spray, it enables high-speed processing, high cleaning power, and low chemical consumption through sheet processing.
Our scrubber equipment utilizes a high-pressure jet with our unique special nozzles, achieving high-speed processing and high cleaning power through sheet processing, while also reducing the amount of chemical solution used. The nozzles can be selected from various methods, including high-pressure jet, two-fluid spray, and one-fluid spray, and combinations of these methods are also possible. We have a proven track record not only in wafer cleaning but also in photo mask cleaning. Additionally, there is no re-adhesion of particles, which is a common issue with DIP processing. The cleaning solution used is pure water, but organic solvents such as NMP can also be selected depending on the specifications. 【Features】 ■ High cleaning power with high-pressure jet method ■ Options for two-fluid and one-fluid spray nozzles! ■ Combinations of high-pressure jet with two-fluid and one-fluid sprays are also selectable ■ No particle re-adhesion *Please feel free to contact us for more details.
Inquire About This Product
basic information
【Main Specifications】 ■ Wafer Size: Compatible with φ2" to φ8" ■ Chemicals Used: Pure water, NMP, etc. ■ Equipment Size: 1330×1550×1900 (for φ8" with 2 cups, main unit) ■ Transport Method: Double-arm clean robot (CLASS 1 compatible) ■ Fire Extinguisher System Many other options available! * For more details, please refer to the PDF document or feel free to contact us.
Price information
-
Delivery Time
※4 to 5 months (usually), but it may vary depending on the situation, so please feel free to contact us.
Applications/Examples of results
Wafer cleaning, mask cleaning
Company information
We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.