Medical applications of ultrasound effects that hold various possibilities! We will solve researchers' concerns.
We would like to introduce a development case of the "Ultra-Compact Ultrasonic Module" handled by Kai Electronics. The product in the image is an "ultra-compact modular ultrasonic irradiation device" that researchers can easily handle. The medical applications of ultrasonic effects hold various possibilities. However, there are significant hurdles to starting experimental applications, including the need for various types of equipment procurement, starting with the cost of instruments. This product can solve the concerns of such researchers. 【Electronic Device Development by Our Company】 - High-efficiency amplifier circuit (enhancing exchange efficiency and reducing heat generation) - Creation of dedicated coils - Signal generation system using CPU and FPGA - Structural design prioritizing thermal efficiency and utilization of aluminum substrates and aluminum enclosures - Design of waterproof aluminum enclosures and manufacturing through aluminum machining *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Phase Control Board for Control Pulses】 ■ PC Interface: UART ■ External Phase Control Pulse Output FPGA Control ■ 5 Temperature Monitors, ADC Control ■ External Control Signal Input ■ Communication with PC (UART) *For more details, please refer to the PDF document or feel free to contact us.*
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For more details, please refer to the PDF document or feel free to contact us.
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Download All Catalogs![[Development Case] Ultra-Compact Ultrasonic Module](https://image.mono.ipros.com/public/catalog/image_generated/01/de8/516108/IPROS75328576035515980938.jpeg?w=120&h=170)
Company information
Kai Electronics Co., Ltd. is a group of design engineers. Within the company, there are three types of engineers specializing in system design, enclosure design, and printed circuit board design, allowing for designs that consider requirements from other processes and pursue optimal solutions from multiple perspectives. For example, we can examine ESD countermeasures from both electrical and mechanical aspects, confirm the interference between printed circuit boards and enclosures, select components based on interference information, and consider board size and layer count, making it easier to aggregate and review information from various design technologies. We are committed to gathering information beyond the boundaries of each of the three design technologies to meet the required specifications and achieve shorter delivery times. Our company is involved in the design of a wide variety of products without specialization in specific applications, handling over 200 new development projects annually for about 30 companies. With the expertise of our design engineers cultivated through these experiences and the coordination skills of our sales representatives, we fully support new product development.
