LSI package design/evaluation analysis contract service

Protect semiconductor chips from external environments and transmit electrical signals to the substrate!

The "LSI Package Design/Evaluation Analysis Contract Service" is not just a report on evaluation analysis results; it is a service that utilizes LSI package design technology, simulation technology, and evaluation analysis technology to identify the causes of failures and determine optimal structures based on simulations. In addition to reporting evaluation analysis results, we also conduct failure cause estimation. We propose analyses aimed at "narrowing down the occurrence process" and "structural optimization" based on the analysis results. 【Features】 ■ We propose suitable analysis methods and analysis steps from our company. ■ In addition to reporting evaluation analysis results, we also conduct failure cause estimation. ■ We propose analyses aimed at "narrowing down the occurrence process" and "structural optimization" based on the analysis results. *For more details, please refer to the PDF document or feel free to contact us.

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