Simple Diagnosis of 'Heat Issues' That Can Be Done for 100,000 Yen (Simulation, Analysis)
Temperature issues in product development require proactive heat dissipation design! Avoid costly heat dissipation measures and significant design revisions (simulation, analysis).
The "Thermal Issue" Simple Diagnosis Service is a service that diagnoses thermal problems in the early stages of product development (simulation, analysis). It predicts product temperature from the concept stage. We report the presence or absence of thermal issues along with one-point advice. Feedback on the validity of product size and heat dissipation policy (whether a fan is needed) is provided in the early design phase. This helps avoid costly heat dissipation measures and significant design revisions. 【Features】 ■ Predicts product temperature from the concept stage ■ Reports the presence or absence of thermal issues along with one-point advice ■ Provides feedback on the validity of product size and heat dissipation policy (whether a fan is needed) in the early design phase ■ Helps avoid costly heat dissipation measures and significant design revisions *For more details, please refer to the PDF materials or feel free to contact us.
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【Things to Prepare】 ■Product Size ■Presence of Ventilation ■Product Power Consumption ■Heating Component Information (Datasheet, Power Consumption) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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As a development and design company, we promote the development, design, and evaluation of semiconductor peripheral circuits and application products through simulation technology.