Mirror polishing method to finish the wrapped pearlescent surface to a smooth surface!
At Shinko Seisakusho Co., Ltd., we perform "polishing processing." Polishing processing is a mirror polishing method that finishes a wrapped surface with a pearly texture to a smooth surface. There are methods such as mechanical polishing and chemical mechanical polishing (CMP), and our company appropriately selects the method according to the various material properties from single crystals, ceramics, metals, to resins, and finishes to your desired surface roughness. We can accommodate various requests for surface roughness ranging from sub-micron to nano-order. If you have any concerns regarding the surface condition of your materials, please feel free to contact us. *For more details, please refer to the PDF document or feel free to reach out to us.
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Our main business focuses on precision processing of various hard materials, specializing in "grinding and cutting," including ceramics, crystalline materials, glass, metals, and resins. In recent years, we have particularly concentrated on ultra-precision cutting and polishing of various ceramics required for electronic components, as well as the power semiconductor field represented by SiC single crystals. In cutting technology, we can perform multi-wire cutting using a fixed abrasive method with diamond wire, and in polishing technology, we can achieve ultra-mirror polishing at the nano level. Additionally, in September 2023, we became Neos Group through M&A, establishing a consistent production system within the group that incorporates Neos's expertise in ultra-precision cleaning technology. If you have any issues with cutting, polishing, or cleaning processes, please feel free to contact Shinko Seisakusho!