[Polishing Technology] Ultra-Precision Wrapping Processing / Ultra-Precision Polishing Processing
From ceramics to metals, glass, and single crystals, we accommodate a wide range of materials! Introducing our processing technology.
Our company specializes in "ultra-precision lapping processing/ultra-precision polishing processing." "Ultra-precision lapping processing" involves performing sliding motion (fitting) while containing free abrasive particles (grinding agents), which polishes the workpiece by micro-cutting, resulting in a flatter finish. "Ultra-precision polishing processing" is a polishing method that finishes the lapped surface to a flat mirror finish. For hard materials, hard polishing processing using diamond powder is employed, while mechanochemical polishing is used for oxides and magnetic materials. 【Features of Ultra-Precision Lapping Processing】 - Free abrasive processing that results in a flatter finish for the workpiece - Achieves high-precision processing surfaces and dimensions - Compatible with a wide range of materials, from ceramics to metals, glass, and single crystals - A processing method has also been developed that uses diamond abrasives fixed to a metal flat plate to generate high-precision surfaces. *For more details, please refer to the PDF document or feel free to contact us.
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【Ultra-Precision Polishing Processing Features】 ■ A polishing method that finishes a lapped pearlescent surface to a flat mirror finish. ■ For hard materials, hard polishing processing using diamond powder is employed, while mechanochemical polishing is used for oxides and magnetic materials. ■ Surface roughness is achieved from sub-micron to nanometer levels. ■ Processing machines are available in both double-sided and single-sided configurations; double-sided machines are used when high precision such as TTV and LTV is required. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our main business focuses on precision processing of various hard materials, specializing in "grinding and cutting," including ceramics, crystalline materials, glass, metals, and resins. In recent years, we have particularly concentrated on ultra-precision cutting and polishing of various ceramics required for electronic components, as well as the power semiconductor field represented by SiC single crystals. In cutting technology, we can perform multi-wire cutting using a fixed abrasive method with diamond wire, and in polishing technology, we can achieve ultra-mirror polishing at the nano level. Additionally, in September 2023, we became Neos Group through M&A, establishing a consistent production system within the group that incorporates Neos's expertise in ultra-precision cleaning technology. If you have any issues with cutting, polishing, or cleaning processes, please feel free to contact Shinko Seisakusho!
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