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  5. Soldering Equipment
  6. Minimum φ0.2mm! Low thermal stress! Laser soldering device for narrow areas.

Minimum φ0.2mm! Low thermal stress! Laser soldering device for narrow areas.

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Laser soldering device

last updated:Jan 22, 2021

進和 戦略営業推進室
進和 戦略営業推進室
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Reduce the consumable costs of soldering irons! Rework in tight spaces is also possible! Reduce deterioration management and replacement labor for soldering irons, as well as decrease quality control labor.

A semiconductor laser soldering system developed by a soldering iron manufacturer that intentionally denies its own products! Utilizing a high-output semiconductor diode laser as the heat source, it achieves quality improvement by non-contact localized heating of mounted components for soldering. ■ Laser used: Adopts single-wavelength and coherent (interferable) light The output area can be narrowed down to standard φ0.4 and φ0.6 (minimum 0.2mm), making it ideal for localized soldering. ■ Minimizes thermal impact on narrow-pitch component mounting and surrounding areas. ■ Compatible solders Uses "rosin-core solder," "solder paste," "solder balls," and other "solder preforms." ■ The laser light is locally irradiated onto the pad surface and solder for speedy bonding! ■ By adopting laser soldering methods, it reduces the constraints of automated equipment, enabling more stable bonding quality than manual work.

    Soldering Equipment
レーザーはんだ付け.jpg

Minimum φ0.2mm! Low thermal stress! Laser soldering device for narrow areas.

レーザーはんだ付け.jpg
レーザーはんだ付け.jpg
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  • Special site - Product/service details - https://pr.mono.ipros.com/shinwa-strategic/product…

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basic information

Recommended Usage: Ideal for mounting narrow pitch components on small circuit boards.

Price range

P6

Delivery Time

Please contact us for details

※It may vary depending on the device configuration, so please feel free to contact us.

Applications/Examples of results

Small lot, diverse product production Small-sized mounting boards Rework of circuit boards, etc.

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Laser soldering device

Laser soldering device

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Company information

進和

進和 戦略営業推進室

Industrial Machinery

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Our company is a development and proposal-oriented trading firm with "metal joining" as the core of our business, actively involved in manufacturing. We offer contract services and maintenance using joining technologies such as brazing, build-up welding, and thermal spraying, as well as sales of equipment and materials, introduction of industrial machinery, and construction of FA systems. Furthermore, we engage in the development and manufacturing of electronics-related devices, achieving a diverse and flexible business style that spans a wide range of fields. We will continue to demonstrate our uniqueness through the pursuit of manufacturing and are committed to contributing to the development of the industrial sector as our mission, striving for business expansion.

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The related categories of Soldering Equipment

  • Manufacturing and processing machinery
  • Mounting Machine
  • Soldering Equipment
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  • #Soldering Equipment
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  • #Laser Soldering Equipment
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