We are proposing a more reliable laser processing method that leverages the characteristics of both UV lasers and CO2 lasers.
6. UV & CO2 Composite Laser Processing ■ No. 6-1: Example of φ100um blind hole processing on fluororesin substrate (Rogers RO3003) ■ No. 6-2: Example of φ100um blind hole processing on Cu + prepreg substrate
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【Contract Processing Request】【Specification Inquiry】 ■For contract processing requests and specification details, please contact us through the inquiry section on this page.
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【Usage/Examples of Achievements】 ■For inquiries about contract processing requests or specification details, please contact us using the inquiry section on this page.
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At Daifune Corporation Japan, we are developing and selling our own brand Vela products, including printed circuit board hole drilling machines and printed circuit board outline processing machines, as well as our own CO2/UV laser processing machines, and we are expanding a technology proposal-based JOBSHOP business. Furthermore, we offer various inspection devices (laser via AOI, hole AOI, fully automatic circuit AOI, X-ray inspection equipment, etc.), various spindles, parts and materials for hole drilling and outline processing machines, as well as a modification/maintenance business for used machines. We will utilize our technological capabilities to propose and realize solutions to various problems, so we look forward to your contact with us.