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  6. A sensor that achieves high-precision and high-speed shape measurement.

A sensor that achieves high-precision and high-speed shape measurement.

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last updated:Mar 30, 2022

プレシテック・ジャパン
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For inline inspection. Supports scanning at 70,000 points per second. Can also measure film thickness. For semiconductor wafer inspection applications.

Our company offers a system that combines the ultra-fast optical scanner 'Flying Spot Scanner (FSS)', which can perform 3D shape measurements with a maximum diameter of 80mm at high speed, with dedicated sensors. It is capable of measuring flatness, thickness, shape, and the arrangement of layers and components both vertically and horizontally with high precision and speed. We also have a wide range of sensors available, which can be selected according to the required measurement range and accuracy. 【Features of FSS】 ■ High precision: Minimum Z-direction resolution of 5nm ■ High-speed scanning: 70,000 points/second ■ Suitable for inline measurement ■ Partial measurements can be freely conducted within the measurement range *For more details, please refer to the materials. Feel free to contact us as well.

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A sensor that achieves high-precision and high-speed shape measurement.

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【Specifications】 《FSS Specifications》 "FSS80"  Principle: Spectral Interference  Lateral Resolution: 21μm  Resolution (Z): Minimum 5nm  Scan Area: 80mm "FSS40"  Principle: Spectral Interference  Lateral Resolution: 6.5μm  Resolution (Z): Minimum 5nm  Scan Area: 40mm 《Sensor Example》 "CHRooodile 2 DW 250"  Measurement Range: 0 to 1800μm (for shape measurement)  Z Direction Resolution: 5nm  Z Direction Linearity: 0.6μm  Sampling Rate: 70kHz  Light Source: Infrared SLD  Communication Method: Ethernet, RS422, Analog, LVDT *For more details, please refer to the documentation. Feel free to contact us with any inquiries.

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[Keywords: Applications, Measurement Items, Benefits, etc.] Non-contact sensors, optical sensors, spectroscopic interference method, thickness, thin films, thick films, gaps, height, flatness, TTV (Total Thickness Variation), shape, measurement, inspection, high speed, 3D, area scan, full surface, high precision, inline, monitoring, offline, standalone devices, tabletop devices, semiconductors, wafers, wafer bonding, Si wafers, Si, GaAs, InP, SiC, LiNbO3 (LN), LiTaO3 (LT), GaN, SiP, Al2O3 (sapphire), PCB, medical balloons, barrier films, PET films, coatings, films, multilayer films, coated films, conformal coatings, electrode layer coatings, stent coatings, polyimide, PVB, resin materials, flux, adhesives, insulating films, air layers, transparent, transparent bodies, gloss, mirror finish, simple.

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プレシテック・ジャパン

プレシテック・ジャパン

Testing, Analysis and Measurement

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Presitech is a specialist in laser material processing and optical measurement technology. We are not just a supplier of systems and components, but a professional partner in ensuring a smooth processing process for our customers. We offer consultations from the foundational stage and accurately consult with customers on their requests and objectives. We understand that the key to success in unique processing processes lies in the four components of exhibition, monitoring, processing, and control. Only by doing so can we provide appropriate solutions for our customers' applications. Our high-quality products, such as laser processing heads, quality monitoring systems, and optical measurement systems for spacing/thickness measurement, allow customers to directly benefit from our decades of experience. Our optical sensors are characterized by the highest precision and dynamic adaptability. Furthermore, they detect accurate values even in high-speed measurements.

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