Micro glass cutting processing, borosilicate glass, glass cutting processed parts.
Fine glass cutting processing, glass cutting processing
**Material** Borosilicate glass **Industry/Application** Electronics and electrical components industry Automotive parts industry Precision components for semiconductors **Dimensions** Thickness: 1.3mm Length: 76mm **Processing** Ultrafast pulse laser processing **Features** This is a cutting process for borosilicate glass. Using ultrafast pulse laser processing, borosilicate glass with a thickness of 1.3mm has been cut. By utilizing filamentation for scribing inside the glass, it is possible to cut non-tempered glass.
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basic information
◆Precision machining of difficult-to-cut materials and complex shapes ◆Automotive parts, medical device parts, electronic components, semiconductor parts ◆Prototype and development projects Leave it to us. We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-chome 4-6, Tokatsu Techno Plaza Room 511 Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/
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Electronics and electrical components industry Automotive parts industry Precision components for semiconductors
Company information
At "HIKARI LASER LAB.", we offer services for precision processing using ultra-short pulse lasers, including "contract processing," "development agency," and "marking." Precision processing and surface modification/internal marking using picosecond and femtosecond lasers are utilized in various industrial equipment across sectors such as the medical industry, automotive industry, and semiconductor industry. Recently, there has been a demand for surface modification not only for shape processing like fine hole drilling, cutting, trimming, and groove processing but also for enhancing functionalities such as water repellency, release properties, friction reduction, and improved sliding properties. Additionally, there is a demand for marking inside glass from the medical industry. Laser processing is possible on a wide range of materials, including transparent materials like glass and diamonds, difficult-to-cut materials like titanium, and resins, CFRP, ceramics, and polyimides. Regarding surface modification, we have received requests to improve the release properties of molds. We will continue to "challenge" ourselves in precision processing and surface modification using ultra-short pulse lasers to meet our customers' needs!
