Fine glass cutting processing, borosilicate glass, glass cutting processed parts.
Fine glass cutting processing, glass cutting processing
【Material】 Borosilicate glass 【Industry and Applications】 Electronics and electrical components industry Automotive parts industry Precision components for semiconductors 【Dimensions】 Thickness 1.3mm 3mm×3mm 【Processing】 Ultrashort pulse laser processing 【Features】 This is a cutting process for borosilicate glass. Made from 1.3mm thick borosilicate glass, it has excellent heat resistance and chemical resistance, making it suitable for laboratory instruments and kitchenware. By utilizing ultrashort pulse laser processing for scribing inside the glass using filamentation, it is possible to cut non-tempered glass.
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◆Precision machining of difficult-to-cut materials and complex shapes ◆Automotive parts, medical device components, electronic components, semiconductor parts ◆Prototype and development projects Leave it to us. We handle everything from processing to equipment setup. Since July 2020, we have launched our satellite site "Ultra Short Pulse Laser.com." It is compatible with smartphone layouts, aiming to create a more user-friendly site. We appreciate your continued support. Hikari Kikai Seisakusho Co., Ltd. ■HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/ Satellite site: https://tyotannpulselaser.com/
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Electronics and electrical components industry Automotive parts industry Precision components for semiconductors
Company information
At "HIKARI LASER LAB.", we offer services for precision processing using ultra-short pulse lasers, including "contract processing," "development agency," and "marking." Precision processing and surface modification/internal marking using picosecond and femtosecond lasers are utilized in various industrial equipment across sectors such as the medical industry, automotive industry, and semiconductor industry. Recently, there has been a demand for surface modification not only for shape processing like fine hole drilling, cutting, trimming, and groove processing but also for enhancing functionalities such as water repellency, release properties, friction reduction, and improved sliding properties. Additionally, there is a demand for marking inside glass from the medical industry. Laser processing is possible on a wide range of materials, including transparent materials like glass and diamonds, difficult-to-cut materials like titanium, and resins, CFRP, ceramics, and polyimides. Regarding surface modification, we have received requests to improve the release properties of molds. We will continue to "challenge" ourselves in precision processing and surface modification using ultra-short pulse lasers to meet our customers' needs!
