There are no microcracks (invisible fine scratches), so it maintains high strength.
The "Hole Drilling Process (TGV)" is a segmented processing method that achieves both high production efficiency and strength. It is designed for applications such as LCD displays, semiconductor devices, and 2.5D and 3D packaging, allowing for fine processing on large glass substrates measuring 730x920mm, with diameters ranging from φ20μm to φ200μm. It can also accommodate processing in the mm order for diameters of approximately φ10mm. 【Features】 ■ Capable of maintaining high strength without the occurrence of microcracks ■ Integrated processing for hole drilling and chemical etching is possible *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Processing Specifications】 ■ Glass types: Non-alkali glass, alkali glass (soda glass), quartz, heat-resistant glass, etc. ■ Glass size: Min 120mm x 120mm, Max 730mm x 920mm ■ Thickness: Min 0.05mm to Max 0.9mm ■ Hole types: Through holes (circular, oval), blind holes (circular, oval) ■ Hole shape: Hourglass shape ■ Hole diameter: φ20μm to φ200μm * Glass surface standards * Thickness limitations apply ■ Options: Fragmentation from large glass sheets with hole processing * Chemical cutting method * For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ 2.5D interposer, 3D packaging ■ LCD displays ■ Semiconductor devices, etc. *For more details, please refer to the PDF document or feel free to contact us.
Company information
Since our founding in 1964, we have been committed to growing through social contributions as the foundation of our management. We focus our business management on the field of surface treatment using chemicals, and we aim to grow and develop together with our customers by continuously proposing technologies that respond to changes in market demands.
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