Observing crystal structures with EBSD! Data can be obtained for each metal.
We will introduce an example of analysis using EBSD for high melting point solder (Pb-based solder containing a small amount of Sn). With the EBSD method, it is possible to infer the grain distribution and residual stress. Additionally, there are analyses that can be performed simultaneously for metals with different crystal structures, allowing for data acquisition for each metal. 【Features】 ■ Ability to infer grain distribution and residual stress ■ Simultaneous analysis for metals with different crystal structures is possible, enabling data acquisition for each metal *For more details, please refer to the PDF document or feel free to contact us.
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![[Information] Regarding the bonding interface of Cu wire bonding.](https://image.mono.ipros.com/public/catalog/image/01/358/499323/IPROS43174235351248870533.jpeg?w=120&h=170)
![[Example of Analysis by EBSD] High Melting Point Solder](https://image.mono.ipros.com/public/catalog/image/528975/IPROS9696731498845934676.jpeg?w=120&h=170)
![[Example of analysis using EBSD] Screw](https://image.mono.ipros.com/public/catalog/image/528966/IPROS14530808166841347476.jpeg?w=120&h=170)
![[Example of analysis using EBSD] Pipe](https://image.mono.ipros.com/public/catalog/image/528968/IPROS2511638378005657325.jpeg?w=120&h=170)
![[Example of analysis using EBSD] Via](https://image.mono.ipros.com/public/catalog/image/528972/IPROS11085550201297771303.jpeg?w=120&h=170)
![[Analysis Example by EBSD] Chip](https://image.mono.ipros.com/public/catalog/image/528959/IPROS190118929289836390.jpeg?w=120&h=170)
![[Example of analysis using EBSD] Silicon wafer](https://image.mono.ipros.com/public/catalog/image/594744/IPROS1304477713812478806.jpeg?w=120&h=170)
![[Case of EBSD] Comparison of two brass materials](https://image.mono.ipros.com/public/catalog/image/643600/IPROS3899155665514901126.jpeg?w=120&h=170)
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.
