The inspector observes without missing anything! Consistent whisker evaluation is possible from reliability testing to analysis.
While lead-free solder is becoming widespread, whiskers formed from Sn plating or solder joints have a significant impact on the reliability of electronic components. Our company offers a consistent whisker evaluation process from reliability testing to analysis. Inspectors carefully observe which components and pins on the substrate have whiskers. 【Features】 ■ Conduct visual inspections of assembled boards after reliability testing to determine the presence of whiskers. ■ If whiskers are detected during visual inspection, observe and measure them using a digital microscope. ■ For more detailed observation and analysis, perform surface SEM/EDX analysis. ■ If necessary, observations and analyses such as cross-sectional observation (SEM) and crystal orientation analysis (EBSD) are also possible. *For more details, please refer to the PDF document or feel free to contact us.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.
